Highest precision for applications with thick and thin resists
The SUSS MicroTec Mask Aligner has become synonymous with superior quality, high alignment accuracy, and sophisticated exposure optics. SUSS MicroTec offers a complete range of mask aligners for high-end fab automation, high volume production and R&D environments alike. SUSS MicroTec designs their mask aligner systems for lithography applications in the field of 3D packaging, advanced packaging, MEMS, LED, compound semiconductors, power devices, photovoltaic, nanotechnology and wafer-level optics.
SUSS MicroTec’s mask and bond aligner platforms perform high precision alignment for mask-to-wafer as well as wafer-to-wafer operations. The equipment processes substrates and wafer up to 300 mm of any kind of material and thickness. With a wide variety of additional functionality the mask aligner not only meets various process requirements but also succeeds with its flexible configuration modes.
Automated Mask Aligners
Semi-Automated and Manual Mask Aligner
* These aligners allow an easy switch to bond aligner functionality by retooling for wafer to wafer alignment.