Automated Mask Aligner Platform
Alignment and Exposure for a Multitude of Applications
Especially designed for high volume production the MA200 Gen3 mask aligner is suited for automated processing of square substrates and wafers up to 200 mm. It combines leading-edge 1x lithography technology with a variety of innovative features making it the system of choice for thick resist MEMS applications, 3D patterning over topography and advanced packaging applications such as 3D packaging, fan-out, bumping as well as compound semiconductor and image sensors.
- Leading process stability
- Unmatched throughput for thick materials
- Process flexibility for a multitude of applications