MA300 Gen2

Highly Automated Mask Aligner Platform for 300mm and 200mm Wafers

The second generation of the SUSS MicroTec MA300 Gen2 is a highly automated mask aligner platform for 300mm and 200mm wafers. It is specifically designed for 3D Packaging, wafer level packaging and flip-chip applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed. The MA300 Gen2 represents a new generation of mask aligners from SUSS MicroTec that are designed to address the requirements of modern high-end fabs in a high volume manufacturing environment.

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