MA/BA8 Gen3

The MA/BA8 Gen3 is easy to integrate into production environments and is highly compatible with SÜSS MicroTec automatic mask aligners. A process transfer from development to production is therefore made easy. It stands out through its well thought-out functionality (it is an industry standard) and a high degree of functional automation. Automated pattern recognition and alignment supports a high production rate and low scrap rate.

High resolution optics and exposure systems as well as the most modern alignment processes make the MA/BA8 Gen3 a valuable tool when venturing into uncharted territory. It supports several imprint processes for micro and nano structures. With only a little adaptation, it allows wafer-to-wafer alignment, easy fusion bonding as well as pre-process plasma treatments of the substrate surface. 


  • Resolution down to  0.5 µm
  • Alignment precision of down to 0.25 µm
  • Light uniformity of up to 3.5%


All alignment technologies of the MA/BA8 Gen3 stand for high alignment accuracy:


Exposure Optics

  • HR and LGO optics
  • Diffraction reducing optics


  • Assisted alignment
  • Auto alignment
  • Image processing
  • Wedge error compensation (WEC)