The MA/BA8 Gen3 is easy to integrate into production environments and is highly compatible with SÜSS MicroTec automatic mask aligners. A process transfer from development to production is therefore made easy. It stands out through its well thought-out functionality (it is an industry standard) and a high degree of functional automation. Automated pattern recognition and alignment supports a high production rate and low scrap rate.
High resolution optics and exposure systems as well as the most modern alignment processes make the MA/BA8 Gen3 a valuable tool when venturing into uncharted territory. It supports several imprint processes for micro and nano structures. With only a little adaptation, it allows wafer-to-wafer alignment, easy fusion bonding as well as pre-process plasma treatments of the substrate surface.
- Resolution down to 0.5 µm
- Alignment precision of down to 0.25 µm
- Light uniformity of up to 3.5%
All alignment technologies of the MA/BA8 Gen3 stand for high alignment accuracy:
- Proximity lithography
- Soft contact
- Hard contact
- Vacuum contact
- HR and LGO optics
- Diffraction reducing optics
- Assisted alignment
- Auto alignment
- Image processing
- Wedge error compensation (WEC)