Highly functional Mask and Bond Aligner for industrial Research and Production
The MA/BA8 Gen3 mask and bond aligner is the most versatile of all the SÜSS MicroTec manual mask aligners, and thus offers a wide range of application possibilities. It supports substrate sizes of up to 200 mm. Thanks to numerous tools and options, as well as settable process parameters, it offers maximum flexibility for research and development, as well transfer to production processes. A fully-developed design and leading edge technology make the MA/BA8 Gen3 the ideal device to develop future technology. Thus it sets new standards for MEMS, Advanced Packaging, 3D integration and compound semiconductor applications.
- High alignment precision and resolution
- Large process range
- Maximum process control