The Dedicated Solution for Industrial Research and Operator Assisted Alignment
The MA/BA8 Gen3 is the new benchmark in full-field lithography for MEMS, Advanced Packaging, 3D Integration and Compound Semiconductor markets. In addition, it supports emerging processes like micro- and nano-imprinting, bond alignment and UV-bonding as well as selective Plasma activation with its unmatched variety of options and maximum flexibility.
- High resolution (HR) optics allow patterning of structures below 0.5µm
- Operator assisted and auto alignment permits <0.25 µm alignment accuracy
- Advanced semi-automatic functions for maximum process control
- Processes compatibility with automated equipment
- Optimized splitfield microscope with eyepieces. Direct viewing and/or LCD flat screen options possible
- Offers a large variety of options