Highest precision for applications with thick and thin resists
The SUSS MicroTec Mask Aligner has become synonymous with superior quality, high alignment accuracy, and sophisticated exposure optics. SUSS MicroTec offers a complete range of mask aligners for high-end fab automation, high volume production and R&D environments alike. SUSS MicroTec designs their mask aligner systems for lithography applications in the field of 3D Packaging, Advanced Packaging, MEMS, LED, Compound Semiconductors, Power Devices, Photovoltaic, Nanotechnology and Wafer Level Optics.
SUSS MicroTec’s mask and bond aligner platforms perform high precision alignment for mask to wafer as well as wafer to wafer operations. The equipment processes substrates and wafer up to 300 mm of any kind of material and thickness. With a wide variety of additional functionality the mask aligner not only meets various process requirements but also succeeds with its flexible configuration modes.
Automated Mask Aligner
Manual Mask Aligner
* These aligners allow an easy switch to bond aligner functionality by retooling for wafer to wafer alignment.