Infrared Alignment

MJB4 Infrared Alignment for IR-transparent materials

Infrared Alignment (IR) allows the handling of opaque, IR-transparent materials as used for thin wafer handling or encapsulation applications.

It is the dedicated solution for backside or buried layers feature alignment with a precision of ± 5 µm (± 2 µm under optimal process conditions).

The MJB4 IR alignment system is delivered with dedicated IR.light source and IR-objectives, one or two video cameras sensitive to wavelengths in the range of 400 to 1200 nm, as well as a video monitor. Special IR chucks are also available.