Post Exposure Bake Module

The MA200 Compact can be equipped with a post exposure bake module, that optimizes mask aligner technology for processing of advanced thick chemically amplified resists. These resists allow for steep resist profiles, especially in fine pitch wafer level packaging applications, such as gold bumping. The post exposure bake module can be directly linked to the mask aligner, offering maximum process control for chemically amplified photo resists that typically require well timed post exposure bakes. After an exposure takes place the wafer is directly transferred into a hot and cool plate stack for the tempering processes.