Product Features & Highlights
MaskTrack Clean
- Highest First-Pass Cleaning Yield
- 100% Particle Removal Efficiency
- Sulfate-Free Cleaning
- Complete Haze Elimination
- Maximum Preservation of Pattern Integrity
- Lowest Cost of Ownership
- Zero Defect on Print Results
- Extends the Lifetime of Your Critical Mask Set
MaskTrack Bake & Develop
- Dynamic Bake Control
- Unparalleled Mask Temperature Uniformity
- Impact-free A+ Nozzle
- Innovative Media Dispense System
- Zero Pattern Collapse
- Total Defect-free Developing
- Best CD Uniformity Performance in the Industry
MaskTrack Family
MaskTrack (90-65nm)
Dual Chamber Photomask Cleaning System
MaskTrack is an automated sulphate-free photomask cleaning system specifically designed for advanced 90-65nm technology nodes. The MaskTrack platform is ideally suited for wafer fab mask maintenance re-clean and mask shop final clean and resist processes.
Product Features & Highlights
- Separate pre-clean and final clean process chamber
- High frequency dual Megasonic cleaning
- Micro droplet jetspray processing
- spin dry
- Ultrasonic readout of all process media critical flow rates
- Ultra-clean Hot DI water
- Electrolyzed H2 and Ozonated DI water, Ultra-Dilute SC1, Hot N2
- Wet substrate transfer between pre and final cleaning chamber
- Wet and dry flip functionality
- Low contact substrate handling
- Pellicalized mask handling capability
- Multiple input / output and substrate buffering stations
- 50nm process media filtration
- 172nm UV surface preparation
- Compact footprint: 2130 x 2140 mm
- SEMI S2/S8 compliance
- Ready for factory automation via SECS/GEM 200 & 300mm standard interface
- ISO Class 3 (Fed Std 209e Class 1) environmental control
- FM 4910 approved
MaskTrack (45-32nm)
Dual Chamber Photomask Cleaning System
MaskTrack is an automated sulphate-free photomask cleaning system specifically designed for advanced 45nm – 32nm technology nodes. The MaskTrack platform is ideally suited for wafer fab mask maintenance re-clean and mask shop final clean and resist processes.
Product Features & Highlights
- Separate pre-clean and final clean process chamber
- Photon induced reactive species generation system
- High frequency dual Megasonic cleaning
- Micro droplet jetspray processing
- Surface tension differential drying method
- Ultrasonic readout of all process media critical flow rates
- Ultra-clean Hot DI water
- Electrolyzed H2 and Ozonated DI water, Ultra-Dilute SC1, Hot N2
- Wet substrate transfer between pre and final cleaning chamber
- Wet and dry flip functionality
- Low contact substrate handling
- Pellicalized mask handling capability
- Multiple input/output and substrate buffering stations
- 30nm process media filtration
- 172nm UV surface preparation
- High temperature substrate treatment up to 300°C for complete removal of residual ions
- Compact footprint: 2130 x 2730 mm
- SEMI S2/S8 compliance
- Ready for factory automation via SECS/GEM 200 & 300mm standard interface
- ISO Class 3 (Fed Std 209e Class 1) environmental control
- FM 4910 approved
MaskTrack (65-22nm)
Single Chamber Photomask Backside Cleaning System
MaskTrack is an automated sulphate-free photomask cleaning system specifically designed for cleaning of pellicallized masks for advanced 65-22nm technology nodes. The MaskTrack Backside Cleaner platform is the perfect solution for wafer fab mask maintenance re-clean and specific problems caused by haze, which occur at 193nm lithography technology. It is also suitable for R&D activities and small batch cleaning of mask blanks.
Product Features & Highlights
- Single substrate final clean process chamber
- Special chuck design providing complete protection of the pellicle, from process chemicals and rinse water
- Megasonic cleaning
- PVA Sponge cleaning
- Micro droplet jetspray cleaning
- Spin dry
- Ultrasonic readout of all process media critical flow rates
- Ultra-clean Hot DI water
- Ultra-Diluted SC1, Hot N2 drying support
- Low contact substrate handling
- 50nm process media filtration
- Compact footprint: 1530 x 1540 mm
- SEMI S2/S8 compliance
- Ready for factory automation via SECS/GEM 200 & 300mm standard interface
- ISO Class 3 (Fed Std 209e Class 1) environmental control
- FM 4910 approved
Bake & Develop
Post Exposure Bake & Develop Platform
The MaskTrack Post Exposure Bake and Develop platform is fully automated and specifically designed for advanced 90-45nm technology nodes. A unique dynamic bake process control function allows for extreme process uniformity, even during temperature ramp.
Product Features & Highlights
- Up to two (2) independently controlled Bake / Chill Stacks
- Automated bake performance optimization
- 90-200 °C bake temperature control
- Integrated temperature sensor array storage
- Recipe fine-tuning based on CD-linewidth feedback
- Interactive bake profile R6D module
- Process Chamber for Develop process step
- Low impact A+ puddle nozzle
- Dynamic Media Mix Control
- Fan spray overlap process
- Ultrasonic readout of all process media critical flow rates
- Rinse and dry
- Low contact substrate handling
- Substrate buffer station
- 30nm process media filtration
- Compact footprint: 1530 x 2140 mm
- SEMI S2/S8 compliance
- Ready for factory automation via SECS/GEM 200 & 300mm standard interface
- ISO Class 3 (Fed Std 209e Class 1) environmental control
- FM 4910 approved
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