Production Coat / Develop Cluster for Wafer Level Packaging

ACS200 Gen3

Changing the Game - Combining the best of Gamma and ACS200Plus platforms

The SUSS ACS200 Gen3 platform is the perfect mix of innovation and production proven components of our well established Gamma and ACS200Plus tools. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.

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