Combining Expertise with Innovation
The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.
- Unmatched configuration flexibility
- Serving HVM and R&D in Advanced Packaging, MEMS and LED markets
- Highest process module count of any 200 mm coater / developer on the market