Wafer Bonder

SUSS MicroTec’s wafer bonding platforms combine more than sixty years of microstructuring experience with solid product quality and a broad range of productivity features. Partnering with research, academia and material suppliers we develop intelligent solutions which offer leading-edge technology for our customers. Our platforms cover many different applications in 2.5D and 3D integration, MEMS, LED and power devices as well as other area of research and development.

Wafer Bonder for Temporary Bonding


Manual Wafer Bonder

Bond Aligner