ABC200

State-of-the-Art Production Wafer Bonding

SUSS MicroTec’s ABC200 production wafer bonding cluster offers superior process performance and unsurpassed productivity. Configurable for up to 200mm wafer sizes the ABC200 is based on different modules that can be put together according to the various needs and applications. The fully automatic cassette to cassette operation opens the door to high volume production with unmatched yield.

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