Semi-Automated Wafer Bonder
CB200M
High Performance Wafer Bonding for advanced MEMS, 3D stacking and LED applications
Achieve unmatched pressure uniformity, alignment stability and thermal performance with the CB200M wafer bonder for MEMS, 3D stacking and LED bonding applications. This 200mm semi-automatic wafer bonder has two components, the CB200 module and the 200M cart loader which loads wafers into the CB200 bond module. Use the CB200M for research and development and for full production, simply remove the loader and dock the CB200 module onto a CBC200 cluster tool.
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