CBC200

200mm Production Wafer Bonder for 3D Interconnect and Advanced MEMS Manufacturing

Designed for advanced MEMS manufacturing and 3D wafer bonding, the CBC200 is a fully automated, best in class, wafer bond cluster with up to 90 kN bond force and 500°C thermal capacity. All standard MEMS fabrication processes as well as emerging eutectic, fusion, and metal diffusion bond technologies for integrated devices can be performed with low cost of ownership.

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