In-situ Cleaning/Bonding Systems
CL200/CL8
CL200 Wafer Cleaning Module/CL8 Cleaner/Bonder
In MEMS, 3D Integration applications it is essential to minimize the time between clean wafers using wet chemistry and bonding. The SUSS CL200/CL8 effectively removes particles from wafer surfaces using SC-1 chemistry and megasonic cleaning. The wafers are then spun dry with notch to notch alignment and automated wafer contacting.
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Remanufactured Equipment
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