BA200 Gen2

SUSS MicroTec mask aligners are well known for their quality, performance, and reliability. The BA200 Gen2 process module uses the same perfected wafer alignment technology as that used in thousands of SUSS MicroTec mask aligners worldwide. Compatible with the ABC200 bond cluster and the CBC200 bond cluster, the BA200 Gen2 achieves a post clamp alignment accuracy of 1.5µm, process dependent. It is also capable of bonding small die and high density interconnects (3D) in advanced devices (or next generation devices).

For superior post bond alignment, Patented Patmax® Autoalign and SUSS MicroTec's proven Automated Wedge Error Compensation (WEC) technologies are integrated into the BA200 Gen2. A granite system base and structure improves thermal and mechanical stability during alignment for improved alignment results.

Product Features & Highlights

• Three different alignment capabilities: face-to-face ISA alignment, backside BSA alignment or TSA/IR alignment
• 1.5µm post clamp alignment accuracy (process dependent)
• Allows bonding of small die and high density interconnects (3D) in advanced devices (or next generation devices)
• Patented Patmax® Autoalign image storing technology identifies a broad of diverse patterns/targets and to accommodate lighting variations, changes in object size and orientation for accurate alignment
• Automated Wedge Error Compensation (WEC) compensates wafer thickness variations and wedge errors to ensure perfect alignment and exposure. The system removes contact between upper and lower wafer and eliminates risk of wafer contamination