BA300UHP

Ultra High Precision Bond Aligner Module

The BA300UHP Ultra High Precision bond aligner module, compatible with the XBC300, can be used to achieve submicron alignment accuracy in Cu-Cu bonding, polymer bonding and fusion bonding.

When configured for polymer bonding or Cu-Cu bonding, the BA300UHP is capable of 350nm post clamp overlay accuracy and uses ISA mode for face-to-face alignment. It allows for smaller via diameters and higher via densities for TSV manufacturing. The alignment accuracy of this module meets the 3D TSV Roadmap through 2012.

Patent pending Radial Pressure Propagation (RPP™) technology is used in the fusion bonding process. RPP™ creates an engineered bond wave which allows the process engineer to control all variables in the align and bond sequence. The unique technology incorporated into the BA300UHP achieves 150nm alignment accuracy.

SUSS MicroTec's revolutionary 300mm tool set combined with new and improved ceramic tooling and fixture design applies full force and temperature across the entire wafer enabling 100% yield in a high precision, contamination free manufacturing environment.

Product Features & Highlights

• Quick and easy ISA mode for face to face alignment featuring built-in self calibration
• Patent pending RPP™ technology gives the process engineer complete control over bond wave propagation
• Ceramic Chuck & Tool Fixture (patent pending) applies full force and temperature across the entire wafer allowing for 100% yield across wafer surface and reduced contamination for better alignment
• Un-rivaled alignment capability using real time, simultaneous image alignments