CB Wafer Bonding Module

200mm-300mm Production Wafer Bonder for 3D Interconnect and Advanced MEMS Manufacturing

The CB200 and CB300 bond chamber modules offer exceptional pressure and temperature uniformity and boast ultra fast heating and cooling for reduced bond cycle time, saving time and money.

While the CB200 handles wafers up to 200mm and is compatible with the CBC200 production wafer bonder for advanced MEMS and 3D processes, the CB300 bonds wafers up to 300mm and is designed for Cu-Cu and polymer bonding with the XBC300 permanent wafer bonder for advanced 3D applications.

Patent pending CB technologies Pressure Column Design, Rigid Superstructure, and Symmetric Top and Bottom Heater Design are incorporated into the CB200 and CB300.

Product Features & Highlights

Patent Pending CB Technologies:

• Pressure Column Design
  • Promotes pressure uniformity across entire surface of wafers
• Rigid Superstructure
  • Isolates load support structure from process chamber
• Symmetric Top and Bottom Heater Design
• Multi-Zone Heating eliminates conductive heat losses