Universal System for Wafer Bonding
With the SB6/8e SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8e presents itself as flexible tool for various applications and process environments. The SB6/8e is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration and 3D integration.
The SB6/8e permits an easy switch from R&D to pilot production and finally high volume manufacturing.
- Process stability
- High throughput capability
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