Manual Wafer Bonding System
SB6/8L
Cost effective, High Precision Wafer Bonder
You don't have to compromise performance in a manual bonder. The SB6L uses the same core bonding technology as SUSS MicroTec's more automated bonders, including precise temperature and force control during bonding, active cooling and fast heating capabilities, and computer controlled wafer processing. The bonding chamber itself has the same rigid and electropolished chamber walls, silicon carbide pressure plates, and precision leveling of chucks.
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