XBC300

Process Development and Production for Advanced 3D Integration Applications

The XBC300 Production Wafer Bonder offers both lower entry price as well as process flexibility for 300mm to configure all common process options for permanent and temporary bonding. Its innovative cluster design features three modules that can be easily interchanged in the field to accommodate changing process requirements or production needs. The process modules are configurable for all major bonding processes needed for 3D applications such as Cu-Cu bonding, polymer bonding, fusion bonding and temporary bonding for thin wafer handling. A wide range of temporary bond processes and materials is supported by the XBC300.

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