BA300UHP
Ultra High Precision Bond Aligner Module
The BA300UHP Ultra High Precision bond aligner module, compatible with the XBC300, can be used to achieve submicron alignment accuracy in Cu-Cu bonding, polymer bonding and fusion bonding.
moreCB Wafer Bonding Module
200mm-300mm Production Wafer Bonder for 3D Interconnect and Advanced MEMS Manufacturing
The CB200 and CB300 bond chamber modules offer exceptional pressure and temperature uniformity and boast ultrafast heating and cooling for reduced bond cycle time, saving time and money.
more
Remanufactured Equipment
Contact
Product Finder