Plasma Treatment

Plasma treatments are more and more employed for surface activation in various wafer and direct bonding applications. In commonly known plasma processes the whole wafer area gets exposed to the plasma, which in some cases can affect or damage the functionality of the micro component or the electronics.

In a joint development project SUSS MicroTec together with Fraunhofer IST have developed SELECT, a method for selective local plasma treatment. SELECT enables local area activation and functional layer deposition and provides new design and manufacturing options especially for MEMS applications, such as microfluidic channels, biochip manufacturing or solar applications.