SELECT

SELECT - Plasma Treatment for Selective Surface Modification

SELECT is based on dielectric-barrier discharge using a glass wafer (dielectric barrier) with metal coating as electrode. The substrate is brought in proximity and AC voltage is applied to ignite plasma at ambient pressure, which makes cost-intensive vacuum technology obsolete.

SELECT has been developed for wafers with and without topography. In the first method for wafers with topography plasma activation is performed either in cavities or on the elevated structures.  The second variation offers treatments for substrates without topography that need to be treated selectively.

Local Plasma Treatment is available as SELECT toolkit on a SUSS MA/BA8 Gen3 mask and bond aligner.