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Top-to-Bottom Side Measurement
Front to Back Alignment Verification
Double side alignment and exposure is frequently used in the manufacture of MEMS, power devices, integrated optics and PCBs. Top-to-bottom side Measurement Systems from SUSS MicroTec are the ideal tool to verify the alignment of your double side alignment and exposure processes.
Automated System
Fully automatic cassette to cassette front-to-back alignment verification offering excellent measurement accuracy and repeatability.
Manual System
Reliabilty, precision and speed make the SUSS MicroTec DSM8 the tool of choice for both the R&D and production environment.
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