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- Adhoc 13-07-2007
Ad Hoc Announcement in Accordance with § 15 of the German Securities Trading Act (WpHG)
SUSS MicroTec AG to Sell Device Bonder Business
Munich, July 13th 2007 - SUSS MicroTec AG (ISIN DE0007226706) has parted with its Device Bonder business segment. SUSS MicroTec S.A.S., a wholly owned subsidiary of the Group holding that is domiciled in St. Jeoire, France, today agreed with the management of SMT S.A.S. on the sale of the Device Bonder business in an MBO to S.E.T. S.A.S., a company owned by the former management of SMT S.A.S. The purchase contract is to be signed and executed on July 16, 2007.
Under the asset deal agreed, all assets and liabilities of SMT S.A.S.’s Device Bonder business will be sold. Transfer of the Device Bonder business was effected for financial purposes on January 1, 2007. The purchase price is EUR 2 million, approximately the difference between the assets transferred and the liabilities taken over by S.E.T. S.A.S. No substantial effect on planned Group sales in the financial year 2007 is anticipated, since SMT S.A.S. will execute all customer orders received by July 16, 2007 for the account of S.E.T. S.A.S.
This sale accords with the Group strategy announced in the Annual Report for 2006 of concen-trating on a few core businesses. There were few synergy effects with other segments of the Group. Moreover, a relevant volume of sales could only have been achieved in combination with other products that do not form part of the SUSS Group portfolio.
Following the sale of the Device Bonder business’s assets, S.E.T. S.A.S. and the SUSS Group will cooperate, among other things to look after existing SUSS Group customers. S.M.T. S.A.S. will continue as a sales company for other SUSS products in France.
The Device Bonder, in contrast to a Wafer Bonder, handles electronic, optical or MEMS (Micro-ElectroMechanicalSystems) components that have already been separated from the wafer. These are then bonded with highest precision either onto another wafer or onto other diced components before the final packaging step.
