Videos, Images and Audio Files
Images
The images in this gallery can be used for editorial or scientific publications and are free of charge.
SUSS MicroTec has to be referred as source: "Courtesy of SÜSS MicroTec AG".
Please kindly send us a copy for our records.
For further image requests (e.g. higher resolution) please contact:
Franka Schielke
Manager Investor & Public Relations
E-Mail: franka.schielke(at)suss.com
Locations
- SUSS MicroTec Headquarters and Mask Aligner Production Site, Garching / Germany
- Sternenfels, Germany. Bonder and Coater Production Site.
- Facility in Corona/CA, USA
Managing Board
- Frank Averdung - CEO
- Michael Knopp - CFO
- Managing Board SÜSS MicroTec AG
Mask Aligner
- MA300 Gen2 - Highly Automated Mask Aligner Platform for 300mm and 200mm Wafers
- MA200Compact - Combining High Resolution with High Throughput and Submicron Precision
- MA/BA8 Gen3 - The Dedicated Solution for the Development of 3D and MEMS Packaging Technologies
Spin- & Spray Coater
- ACS300 Gen2 - Production Spin Coat / Develop Cluster for Wafer Level Packaging
- ACS200 Gen3 - Changing the Game - Combining the best of Gamma and ACS200Plus platforms
Wafer Bonder
- XBC300 Gen2 - Permanent Bonding and Debonding / Cleaning Solution for 3D Integration Processes
- XBS300 - Universal Temporary Wafer Bonder for High Volume Manufacturing
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