Product Features & Highlights

MaskTrack Clean

  • Highest First-Pass Cleaning Yield
  • 100% Particle Removal Efficiency
  • Sulfate-Free Cleaning
  • Complete Haze Elimination
  • Maximum Preservation of Pattern Integrity
  • Lowest Cost of Ownership
  • Zero Defect on Print Results
  • Extends the Lifetime of Your Critical Mask Set
    MaskTrack Bake & Develop
  • Dynamic Bake Control
  • Unparalleled Mask Temperature Uniformity
  • Impact-free A+ Nozzle
  • Innovative Media Dispense System
  • Zero Pattern Collapse
  • Total Defect-free Developing
  • Best CD Uniformity Performance in the Industry

MaskTrack Family

MaskTrack (90-65nm)

Dual Chamber Photomask Cleaning System

MaskTrack is an automated sulphate-free photomask cleaning system specifically designed for advanced 90-65nm technology nodes.  The MaskTrack platform is ideally suited for wafer fab mask maintenance re-clean and mask shop final clean and resist processes.

Product Features & Highlights

  • Separate pre-clean and final clean process chamber
  • High frequency dual Megasonic cleaning
  • Micro droplet jetspray processing
  • spin dry
  • Ultrasonic readout of all process media critical flow rates
  • Ultra-clean Hot DI water
  • Electrolyzed H2 and Ozonated DI water, Ultra-Dilute SC1, Hot N2
  • Wet substrate transfer between pre and final cleaning chamber
  • Wet and dry flip functionality
  • Low contact substrate handling
  • Pellicalized mask handling capability
  • Multiple input / output and substrate buffering stations
  • 50nm process media filtration
  • 172nm UV surface preparation
  • Compact footprint: 2130 x 2140 mm
  • SEMI S2/S8 compliance
  • Ready for factory automation via SECS/GEM 200 & 300mm standard interface
  • ISO Class 3 (Fed Std 209e Class 1) environmental control
  • FM 4910 approved

MaskTrack (45-32nm)

Dual Chamber Photomask Cleaning System

MaskTrack is an automated sulphate-free photomask cleaning system specifically designed for advanced 45nm – 32nm technology nodes. The MaskTrack platform is ideally suited for wafer fab mask maintenance re-clean and mask shop final clean and resist processes.

Product Features & Highlights

  • Separate pre-clean and final clean process chamber
  • Photon induced reactive species generation system
  • High frequency dual Megasonic cleaning
  • Micro droplet jetspray processing
  • Surface tension differential drying method
  • Ultrasonic readout of all process media critical flow rates
  • Ultra-clean Hot DI water
  • Electrolyzed H2 and Ozonated DI water, Ultra-Dilute SC1, Hot N2
  • Wet substrate transfer between pre and final cleaning chamber
  • Wet and dry flip functionality
  • Low contact substrate handling
  • Pellicalized mask handling capability
  • Multiple input/output and substrate buffering stations
  • 30nm process media filtration
  • 172nm UV surface preparation
  • High temperature substrate treatment up to 300°C for complete removal of residual ions
  • Compact footprint: 2130 x 2730 mm
  • SEMI S2/S8 compliance
  • Ready for factory automation via SECS/GEM 200 & 300mm standard interface
  • ISO Class 3 (Fed Std 209e Class 1) environmental control
  • FM 4910 approved

MaskTrack (65-22nm)

Single Chamber Photomask Backside Cleaning System

MaskTrack is an automated sulphate-free photomask cleaning system specifically designed for cleaning of pellicallized masks for advanced 65-22nm technology nodes.  The MaskTrack Backside Cleaner platform is the perfect solution for wafer fab mask maintenance re-clean and specific problems caused by haze, which occur at 193nm lithography technology. It is also suitable for R&D activities and small batch cleaning of mask blanks.

Product Features & Highlights

  • Single substrate final clean process chamber
  • Special chuck design providing complete protection of the pellicle, from process chemicals and rinse water
  • Megasonic cleaning
  • PVA Sponge cleaning
  • Micro droplet jetspray cleaning
  • Spin dry
  • Ultrasonic readout of all process media critical flow rates
  • Ultra-clean Hot DI water
  • Ultra-Diluted SC1, Hot N2 drying support
  • Low contact substrate handling
  • 50nm process media filtration
  • Compact footprint: 1530 x 1540 mm
  • SEMI S2/S8 compliance
  • Ready for factory automation via SECS/GEM 200 & 300mm standard interface
  • ISO Class 3 (Fed Std 209e Class 1) environmental control
  • FM 4910 approved

Bake & Develop

Post Exposure Bake & Develop Platform

The MaskTrack Post Exposure Bake and Develop platform is fully automated and specifically designed for advanced 90-45nm technology nodes. A unique dynamic bake process control function allows for extreme process uniformity, even during temperature ramp.

Product Features & Highlights

  • Up to two (2) independently controlled Bake / Chill Stacks
  • Automated bake performance optimization
  • 90-200 °C bake temperature control
  • Integrated temperature sensor array storage
  • Recipe fine-tuning based on CD-linewidth feedback
  • Interactive bake profile R6D module
  • Process Chamber for Develop process step
  • Low impact A+ puddle nozzle
  • Dynamic Media Mix Control
  • Fan spray overlap process
  • Ultrasonic readout of all process media critical flow rates
  • Rinse and dry
  • Low contact substrate handling
  • Substrate buffer station
  • 30nm process media filtration
  • Compact footprint: 1530 x 2140 mm
  • SEMI S2/S8 compliance
  • Ready for factory automation via SECS/GEM 200 & 300mm standard interface
  • ISO Class 3 (Fed Std 209e Class 1) environmental control
  • FM 4910 approved