Manual Spray Coater

Delta AltaSpray

Manual Spray Coater for High Topographies

SUSS MicroTec's proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few microns to 600µm and more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-integration and Wafer Level Packaging applications like 3D image sensor packaging.

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