Dedicated Mask Aligner Solution for High Volume Production of Compound Semiconductors Devices

With the MA100/150e Gen2 SUSS MicroTec has designed a dedicated mask aligner platform for processing critical compound semiconductors, such as high brightness LEDs (HB-LEDs), power devices, RF-MEMS and many more. With its high precision alignment, customized substrate handling for fragile, warped and transparent wafers and its high resolution down to 0.7µm the MA100/150e Gen2 is able to overcome all lithography challenges given by the LED manufacturing process.

Based on SUSS MicroTec's production proven mask aligner design the MA100/150e Gen2 enables exceptional process scalability and fast time-to-market for new device designs, while the industry leading throughput of 145 wafers per hour reduces cycle time.

The MA100/150e Gen2 is optimized for wafers sizes up to 6". The system reliably achieves an alignment accuracy of < ±0.7 µm (DirectAlign). Bottomside alignment (BSA) is optionally available offering an alignment accuracy of < ±1.5 µm. The alignment unit of the MA100/150e is tailored to the specific requirements of LED manufacturing, offering excellent contrast even on transparent and textured wafers.

For applications using scribe lines the new 'Line Alignment' function allows precise alignment of pre-scribed sapphire wafers to the photo mask without need of traditional wafer targets.

• Datasheet MA100/150e Gen2

• High Volume Production