Enabling Lithography Solutions for 3D Packaging

Mask aligners from SUSS MicroTec have become critical important for applications like chip stacking and 3D image sensor packaging. They are dubbed LGO (Large Gap Optics) exposure optics are specifically created for applications involving high topographies and are able to resolve features of 20-30um in a typical resist film of 10um over topographies of several hundred microns. SUSS Mask Aligners are successfully used for opening resist at the bottom of vias. Their unsurpassed precision makes them ideally suited for 3D lithography applications such as dicing streets or backside redistribution layers (RDLs).

The SUSS proprietary AltaSpray spray coating technology is capable of depositing high-resolution resist films on different 3-D microstructures, while being able to deliver consistent conformal coatings on various structures such as v-grooves or trenches. SUSS AltaSpray has been successfully employed with many resists ranging from typical positive tone novolak resists to polyimides and other dielectrics.

Combining the AltaSpray Technology with the SUSS LGO Optics guarantees most effective patterning of high topographies for various applications.

• Lithographic Challenges and Solutions for 3D Interconnect