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Photolithography for Thick Resists
Thick resist photolithography is an indispensable element of wafer bumping and advanced wafer level packaging in general. Leading systems for these processes are mask aligners and steppers, while for resist coating applications spin and spray coaters dominate.
Mask aligners are 1X full field exposure systems that offer an excellent cost of ownership and ease of use compared to competing stepper technology. All SUSS production aligners can be equipped with the Large Gap Exposure Optics (LGO) optics enabling near vertical sidewalls at highest aspect ratios in resist films up to 100 microns and thicker. In addition SUSS Mask Aligners support a variety of technology enhancements, which increases resolution, improves overlay accuracy and boosts wafer yield, enabling cost effective mask aligner technology to meet even the most demanding performance criteria.
Application Results
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Re-passivation and stress buffer layers Asahi PIMEL I-8000 series polyimide, 5 micron thickness after cure, suppressed crowning. Coated with SUSS Spin Coater and exposed with SUSS MA200 Mask Aligner
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Re-passivation and stress buffer layers HD4000 polyimide, Tapered profile after 374°C cure. Coated with SUSS ACS200Plus Spin Coater and exposed with SUSS MA200 Mask Aligner
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Photosentive BCB 5µm Cu, 12µm BCB, 5µm Cu 40µm proximity gap Coated and exposed with SUSS equipment.
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Solder bump photolithography THB 151N, negative resist 65µm thick, 50µm solder moldes, 75µm proximity, broadband exposure Coated with SUSS Spin Coater and exposed with SUSS MA200 Mask Aligner
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Solder bump photolithography THB 151N, negative resist 65µm thick, 50µm solder moldes, 75µm proximity, broadband exposure Coated with SUSS Spin Coater and exposed with SUSS MA200 Mask Aligner
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Solder bump photo lithography TOK_DFR P 50100, dry film resist 110 micron thick, 50µm window 50µm proximity, Coated with SUSS Spin Coater and exposed with SUSS MA200 Mask Aligner
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Gold bump photolithography TOK PMER P-CA 1000PM, positive resist, chemically amplified Bump/space 20/7µm (top) and 20/5 (below) Coated and exposed with SUSS ACS200 Plus Coater and MA300Plus Mask Aligner
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Gold bump photolithography TOK PMER P-CA 1000PM, positive resist, chemically amplified Bump/space 20/5µm Coated and exposed with SUSS ACSPlus Coater and MA300Plus Mask Aligner
