TSV Manufacturing

Through silicon vias (TSV’s) are a key component in 3D interconnect. TSV’s improve electrical performance, reduce power consumption and shrink device sizes.

Manufacturing TSV’s involves via etching and filling. Prior to the vias being etched, the etch mask must be created which involves coating, alignment and exposure. SUSS precision aligners and coating equipment is used for these steps.

The new MA300 mask aligner is capable of standard topside alignment with accuracies down to 0.5µm (DirectAlign) the new 3D-alignment platform enables bottom side and infrared alignment for 200 mm or 300 mm based three-dimensional (3D) lithography applications. These enhanced alignment/overlay capabilities combined with Large Gap Exposure Optics allow the MA300 Gen3 to meet the high topography demands of 3-D lithography.

In addition, depending on the via diameter, SUSS equipment can perform the subsequent lithography steps needed to create the vias themselves.

• Via holes with sidewall angle of 80°
• Reliable coating using AltaSpray
• Contact pad opening
• Contacts of 10 µm in 80 µm deep vias are clearly resolved
• Spray Coat on Gamma AltaSpray
• Exposure on MA200compact
• Spray Develop on Gamma