Bonding Technology

Enabling Advanced MEMS Products and Integrated Electronics

MEMS manufacturing is migrating to advanced metal eutectic and diffusion bonds. SUSS offers a number of production wafer bonder platforms, ABC200, CBC200/300 and XBC300, that meet the needs of these advanced MEMS processes.

Features and Benefits

  • High force with unrivaled pressure uniformity to within ±5% of setpoint
  • Temperatures up to 600°C with the temperature uniformity needed to control diffusion bonding of metal hermetic seals
  • Flexible Cluster Software that optimizes production throughput and has been proven on hundreds of installed clusters