Anodic Wafer Bonding

Anodic wafer bonding is used in MEMS processes whenever an ionic glass is used in the sensor fabrication. SUSS MicroTec aligner products include options for laser tacking and triple stack alignment which work in tandem with our wafer bonders to realize many advanced products. During triple stack wafer bonding three layers, glass/Si/glass, can be bonded simultaneously to increase functionality and throughput.

SUSS MicroTec provides complete production and development tools for anodic applications. Our experience can help bring your anodic process to production capacity with proven fixture and process cluster options currently in 24/7 production operations around the world.

Main Markets

  • MEMSGyroscopes, Accelerometers RF, Pressure Sensors