Next Generation Lead-Free and Low Cost Wafer Bumping

IBM and SUSS MicroTec AG are working together to develop and commercialize IBM's next-generation,100% lead-free semiconductor packaging technology, C4NP.

C4NP (Controlled Collapse Chip Connection New Process) is a totally new first flip chip technology which is set to revolutionize the bumping process. It allows the creation of pre-patterned solder balls to be completed while a wafer is still in the front-end of a manufacturing facility, reducing cycle time significantly. The solder bumps can be inspected in advance and deposited onto the wafer in one simple step using technology similar to wafer-level bonding. The technology employs the simplicity of solder paste (stencil/screen), but instead uses pure molten alloy to produce the fine pitch capability of electroplating.

Process Details

• Technology
• Tools

• FAQs
  • General Questions
  • Process
  • Molds (Templates)
  • Mold Fill Tool (MFT)
  • Solder Transfer Tool
  • Business Aspects

Mold Fill Process Video