Thick Resist Coating for MEMS
Fabricating the many different varieties of microelectromechanical systems (MEMS) poses complex processingchallenges. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon and it can consist ofdifferent shapes and materials. Spin and Spray Coaters from SUSS MicroTec allow for flexible adaption to the various special handling and requirements. Double side structured, warped and bowed wafers canbe easily accommodated. For thin wafers handling special tooling is available.
Spin coaters from SUSS MicroTec are able to deliver consistently uniform results for a variety of applicationssuch as thin and thick resists, planarization, BCB, polyimide and other dielectrics. SUSS own patented GYRSETcoating technology enables fringe free thick resist coating with reduced chemical consumption.
Spray Coaters from SUSS MicroTec are capable of depositing high resolution thick resist films on different 3D microstructures, while being able to deliver consistent conformal coatings on various structures such as 90° corners, KOH etched cavities, V-grooves or even deep TSVs.
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Conformal spraycoating of a KOH etched sidewall with topography variation of 200µm. Achieved with AZ4999 from AZ Electronic Materials. Courtesy: CIS Erfurt
7.8 micron of BCB spin coating.
Cross section
Spin Coated with SUSS Gamma System
