MEMS Manufacturing

Microelectromechanical Systems

When it comes to manufacturing intelligent systems such as sensors and actuators (MEMS), processes from the field of microsystem technology have a proven record of success. Backend-of-line manufacturing processes allow for structuring of MEMS wafers at a resolution of a few micrometers. The advantages of producing and packaging sensors and actuators at wafer level are obvious. When processing several thousand components at the same time, operating costs can be reduced considerably. State-of-the-art packaging processes further make it possible to reduce the size of MEMS components – this benefit is taken advantage of by many manufacturers of devices.

Interesting Facts about SUSS MicroTec and MEMS

as number one manufacturer for mask aligner lithography

systems installed worldwide

supported process technologies

of the top 50 universities use SUSS technology

ALL-IN-ONE-HAND supplier

There is no way around SUSS MicroTec when looking for high-quality processing equipment for MEMS applications. The product portfolio of this established all in one-hand supplier covers all the important steps such as lithography and bonding processes for production of sensors and actuators.

High process flexibility

Equipment from SUSS MicroTec not only offers indispensable multifunctionality in a single unit. Every system also provides considerable flexibility when it comes to process design. In terms of process support, the experience of a globally operating manufacturer provides valuable help when choosing the right technology, especially since the right partner can provide the competitive edge essential to a company’s success.

Easy process transfer

The compatibility of different SUSS systems with each other provides an important benefit for the critical transition from one process step to the next. Also important: with the proven systems from SUSS MicroTec customers can smoothly navigate the process transfer from the development stage to start of serial production and ultimately into mass production.

Special Solutions for MEMS

Particularly for MEMS applications, SUSS MicroTec has a lot to offer: Special tooling allows for high-precision processing of applications with a high aspect ratio. Whether you are looking for a special uniform coating of thick resists with the GYRSET coating process or excellent pattern fidelity with superior optics, the equipment from SUSS MicroTec can meet the challenges of high topography. The design of the systems allows for special processing of MEMS wafers such as double-sided processing.

Special substrate handling

Through special edge handling and the careful treatment of thin or curved wafers, we ensure that wafers and sensitive components are protected during MEMS applications. SUSS MicroTec also offers special treatment of substrates outside SEMI standards. Especially with exotic substrate shapes and materials, the equipment can be adapted to the most diverse process requirements.

Processing MEMS: Highly Versatile equipment

Substrates

100, 150, 200 300 mm wafer size
square formats
small pieces
thin, curved, heavy or other exotic wafers

Substrate Material

GaAs (gallium arsenide)
SiC (silicone carbide)
InP (indium phosphide)
LiTaO₃(lithium tantalate)
LiNbO₃(lithium niobate)
and many more

Process Material

all thick photoresists such as SU8
Polyimide and PBO
Negative and positive resists
Developer / cleaning solvents
Bond interfaces: Au-Au, Cu-Cu, Al-Ge,…

Covering all the Critical Processes for MEMS Production

SUSS MicroTec systems cover a wide range of challenging process steps such as structuring using photolithography.

Product Portfolio

For production or wafer-level packaging of sensitive components, SUSS MicroTec has a series of high-quality systems in its portfolio. The equipment supports the processing of wafers up to 300 mm in size at a resolution in the micrometer range. Depending on the requirements, the portfolio offers systems for manual, semi-automated or fully automated operation.