print «back

ACS200Plus

Universal Production Spin Coat / Develop Cluster

Features and Benefits

  • Scalable cluster architecture with independent, field upgradeable Dock & Lock process modules
  • Substrates round from 2" up to 200mm and square from 2" up to 6"
  • Parallel flow functionality for optimized machine utilization
  • GYRSET closed bowl coating technology
  • Spray Coating Capability

The ACS200Plus is a modular spin coating and developing cluster covering wafer sizes from 2" up to 200mm and square substrates from 2" up to 6". No mechanical changeover is needed between several different substrate sizes. The system offers superior performance in spin and spray coating, baking and developing wafers for a variety of applications such as thin and thick resists or photosensitive polymers (e.g. polyimide, Cyclotene (BCB)). The system’s features address all requirements for sophisticated photoresist processing that are mainly used in the optoelectronics, MEMS and advanced packaging markets.

The modular design of the ACS200Plus permits unmatched configuration flexibility, that allows flexible production planning from R&D/ pilot production to high volume production stage. Process modules can be configured in a 2, 4 or 6 module cell around a central robot. Additional cells can be added for larger configurations.

The system can be optionally equipped with the GYRSET feature that generates uniform films by avoiding turbulence and creating a solvent rich local coating environment.

The ACS200Plus can be interfaced with the MA200Compact mask aligner to form the integrated LithoFab200 cluster.