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ACS200Plus

Superior Spin and Spray Coating Cluster for Volume Production

The ACS200Plus is a modular and automated cluster system designed to meet manufacturers' needs for clean, reliable, high throughput, and modular photolithography processing. SUSS MicroTec ACS200Plus systems can be equipped with sender/receiver cassette stations and modules for HMDS vapor priming, spin coating, spray coating, aqueous or solvent based wet processing, baking and cooling. Each process module comes in an individual Dock & Lock frame and can therefore be upgraded in the field. Process modules can be configured in a 2, 4 or 6 module cell around a central robot. Additional cells can be added for larger configurations. The tool can process wafers from 2" to 200mm in diameter and square and rectangular substrates from 2" up to 6" edge length. Different wafer sizes can be processed simultaneously without any mechanical changeover.

SUSS ACS200Plus systems are engineered with special attention to modularity and configuration flexibility. They address all requirements for sophisticated photoresist processing and are mainly used in 3D-Packaging, MEMS and compound semiconductor applications.

SUSS ACS200Plus systems can be configured for low and high volume manufacturing.

The ACS200Plus can be interfaced with the MA200Compact mask aligner to form the integrated LithoFab200 cluster.

Product Highlights

  • Scalable cluster architecture with independent, field upgradeable Dock & Lock process modules
  • Optionally equipped with
    • GYRSET® closed cover coating technology
    • AltaSpray coating technology
  • Toolings for edge handling, thin wafer handling and warped wafer available
  • Flexible software platform with advanced wafer scheduler

Technologies

Upgrades