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Delta 80RC

Universal Spin Coating System for Wafers up to 200mm

The Delta 80RC is the ideal platform for manual and semi-automated spin coat and puddle develop processes in R&D and low-volume fabrication. A wide variety of substrates including pieces, wafers from 2" to 200mm in diameter and square substrates from 2" up to 6" edge length can be processed.

SUSS MicroTec Delta 80RC offers both, GYRSET® closed cover coating as well as conventional open bowl coating with high acceleration capabilities needed for some thin resist applications. The GYRSET® closed cover coating technology offers enhanced uniformity and significant cost savings of up to 60 percent, depending on resist chemistry.

The Delta 80 can also be used for puddle develop processes using aqueous based chemistry.

The manual product line of SUSS MicroTec coaters and developers offers easy recipe transfer to automated platforms.

The ability to produce resist thicknesses in the range of below 1µm to over 100µm makes them the ideal choice for R&D, MEMS, Wafer Level Packaging and the compound semiconductor industry.

SUSS MicroTec Delta 80RC is available as stand-alone or bench-mounted system. The Delta80RC is engineered to comply with the most stringent safety requirements (SEMI S2). For open bowl spin processing >1000 rpm the system is equipped with an upper enclosure.

Product Highlight

  • GYRSET® technology and traditional open bowl spinning for all major applications
  • Puddle develop capability
  • Large selection of resist pumps as well as standard and customized chucks
  • Programmable dispense arm with up to 4 resist lines or 2 lines plus motorized syringe dispense option
  • Brushless servomotor operating in a closed loop mode provides spin speeds up to 10.000 rpm
  • Up to 20 recipes with 40 steps can be stored in the standard controller
  • Chuck indexing for easy load / unload
  • Laptop option

Technologies

Upgrades