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Delta AltaSpray

Manual Spray Coater for High Topographies

SUSS MicroTec's proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few microns to 600µm and more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-integration and Wafer Level Packaging applications like 3D image sensor packaging.

SUSS MicroTec Delta AltaSpray is the ideal tool for R&D and low-volume fabrication. Substrates up to 200mm in diameter and square subsrates up to 6" edge length can be processed. The system can be equipped with up to two separate spray dispense systems. The sophisticated resist supply system offers unmatched process stability and reproducibility. All spray and cleaning parameters can be programmed in the recipe.

The manual product line of SUSS MicroTec coaters offers easy recipe transfer to automated platforms.

Product Highlights

  • Enabling technology for patterning across severe topography
  • Conformal coating with top edge coverage while avoiding resists accumulation in trenches
  • Proprietary spray design for optimal process stability and reproducibility
  • Substrate sizes up to 200mm in diameter and square substrates up to 6" edge length
  • Up to 2 separate spray dispense systems to avoid cross contamination
  • Laptop with Windows XP operating system and MMC controller software
  • All process parameters are programmable in the recipe

Technologies

Upgrades

  • Additional spray dispense system