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Gamma

Spin Coat and Develop Platform for Volume Production and R&D

Features and Benefits

  • Compact footprint
  • Easy access for the maintenance of all parts
  • Can be optionally equipped with SUSS GYRSET® closed cover coating technology
  • Accommodates silicon, GaAs, LiNbO3, LiTaO3, InP, sapphire, glass, flexible plastic
  • Edge handling option for wafers with structures on both sides

The Gamma automated photoresist processing system is designed to meet manufacturers’ needs for clean, reliable, high throughput, and cost-effective photolithography processing. SUSS Gamma systems can be equipped with modules for spin coating, spray coating, developing, baking, cooling, HMDS vapor priming, and with sender/receiver cassette stations. Gamma coaters can process wafers from 2" to 200 mm in diameter and square and rectangular substrates from "2 up to 6" on a side. Different wafer sizes can be processed simultaneously without any mechanical changeover. SUSS Gamma Systems are engineered with special attention to fragile wafer handling and minimum wafer contact. They are the ideal tools for thick resist MEMS and advanced wafer bumping applications.

SUSS Gamma systems can be configured for low and high volume manufacturing.