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Gamma AltaSpray
Production Spray Coater for High Topographies
The proprietary AltaSpray coating technology from SUSS MicroTec uses a uniquel resist deposition method that is capable of depositing high resolution resist films on different 3-D microstructures, by enabling the delivery of consistent conformal coatings on various structures such as 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses. AltaSpray technology is becoming critically important for applications like 3D image sensor packaging.The proprietary AltaSpray coating technology from SUSS MicroTec uses a uniquel resist deposition method that is capable of depositing high resolution resist films on different 3-D microstructures, by enabling the delivery of consistent conformal coatings on various structures such as 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses. AltaSpray technology is becoming critically important for applications like 3D image sensor packaging.
The Gamma AltaSpray coating platform fulfills all common volume production requirements. The fully automated cluster delivers reliable, uniform coatings and offers high reproducibility. Gamma AltaSpray can be equipped with modules for spray and spin coating, developing, baking, cooling, HMDS vapor priming and with sender/receiver cassette stations.
Product Highlights
- Enabling technology for patterning across severe topography
- Reliable top edge coverage while avoiding resists accumulation in trenches
- Proprietary spray design for optimal reproducibility and cleanliness
- Parallel processing of spray and spin coater wafers
- Substrate sizes up to 200mm in diameter and 6”x6” squares
