Mask Aligner

Unmatched Precision for Thin and Thick Film Applications

The SUSS MicroTec Mask Aligner has become synonymous with superior quality, accuracy, and high quality exposure equipment. SUSS MicroTec offers a complete range of mask aligners for high-end fab automation, volume production and R&D environments alike. SUSS MicroTec Mask Aligners process wafers up to 300mm and can be equipped with technologies that significantly increase throughput, achieve 1 micron resolution and sub-micron overlay and significantly reduce lithography costs.

Production Mask Aligners

Highly automated systems for wafers up to 300mm – 3D Integration, Wafer Bumping, Wafer Level Packaging, MEMS, Compound Semiconductor

MA300 Gen2 (Wafer sizes up to 300mm)
MA200Compact (Wafer sizes up to 200mm)
MA150e (Wafer sizes up to 150mm)

Upgrades: MO Exposure Optics

Manual/Semiautomated Mask Aligners

Aligner Platform for industrial research and operator assisted production – MEMS, Wafer Level Packaging, 3D Integration, Compound Semiconductor, Nanotechnology, Microoptics

MA/BA8 Gen3 (Wafers sizes up to 8")

Upgrades:

Bond Aligner
Imprinting MA/BA8 Gen3: UV-NIL, SCIL, SMILE
Near Field Holography: MA6/8 NFH
MO Exposure Optics

Manual Mask Aligners

Aligner Platform designed for research, development and pre-production environments – MEMS, Wafer Level Packaging, 3D Integration, Compound Semiconductor, Nanotechnology

MJB4 (Wafer sizes up to 4")
MA/BA6 (Wafer sizes up to 6")
MA/BA8 (Wafer sizes up to 8")