- You are here:
- Home >
- Products >
- Lithography >
- Mask Aligner >
- Ma6
MA/BA6 (Gen2)
Features and Benefits
- Accurate and precise gap setting for higher yield
- Parameter storage saves set-up time and improves process consistency
- High-quality exposure optics: Diffraction reducing lenses provide high resolution and optimum edge quality with thick resists
- High intensity light sources reduce process time
- Intelligent exposure control unit monitors lamp intensity and life time
The SUSS MicroTec MA/BA6 Mask Aligner is regarded as the benchmark from semiconductor submicron research to 3D micro-system production. The innovative systems meets customer's needs for precision, reliability and low cost of ownership.
The versatile MA/BA6 is available with bottom-side-alignment microscopes for accurate backside processes. Bottom-side-alignment has become an important feature, especially in Microsystem Technology.
For all classic lithography and topside alignment an eyepiece or a dual video microscope are available. Beside the standard lithography application with diffraction reducing exposure optics for highest resolution the MA/BA6 Mask Aligner offers special techniques for :
- Bond Alignment,
- Near Field Holography,
- UV-Curing processes,
- UV-NIL, etc.
