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MA/BA8
Features and Benefits
- Multiple exposure modes and precise gap setting for optimized lithography processes
- Dual video or eye piece microscope
- BSA microscope with dual magnification
- SUSS image storage for precision alignment even in large gaps
- Optimum exposure quality also in thick resists:
steep edge slopes and high aspect ratio
The SUSS MicroTec MA8 Maks Aligner is the system solution for 200mm lithography applications for development and pilot production of IC back end processes. The MA8 provides full laboratory mask aligner versatility and flexibility. The compatibility of the exposure modes allows processes to be developed on the MA8 which can then be run in production on a SUSS MicroTec MA200 Production Mask Aligner.
The MA8 meets the requirements of back end applications such as passivation and thin film bumping. Thick resist performance also recommends the MA8 for microsystem technology applications where bottom side alignment is requested. The MA8 is also regarded as an ideal tool for telecom and optoelectronics applications.
Beside the standard lithography application with diffraction reducing exposure optics for highest resolution the MA8 offers special techniques for:
- Bond Alignment,
- Near Field Holography,
- UV-Curing processes,
- UV-NIL, etc.
