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DSM200

Fully Automated Top-to-Bottom Side Alignment Verification System

Features and Benefits

  • Unsurpassed measurement accuracy of 0.2µm
  • High repeatability on a fully automated system
  • Self-calibration during operation!
  • Measurement area: full wafer surface, unlimited number of measurement points
  • No operator impact on results

With the DSM200 SUSS MicroTec introduces the automated metrology tool of choice for all emerging front to backside alignment applications. The cassette-cassette front-to-back alignment metrology system is the ideal tool for verifying alignment accuracy on wafers from 2 inch to 200mm. Incorporating the latest pattern recognition technology, the DSM200 offers the highest measurement accuracy of 0.2um at 3sigma on a fully automated platform with minimized operator intervention. Based on the latest-generation SUSS MA200Compact Mask Aligner, the DSM200 provides reliable and accurate metrology for double-sided alignment and exposure applications frequently used in the manufacturing of MEMS devices, power semiconductors and optoelectronics.