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DSM8
Manual Top-To-Bottom Side Alignment Verfication System
The SUSS MicroTec DSM 8 is the ideal tool for verifying alignment for front-to bottomside exposed or bonded wafers or substrates from on 2" to 8". The straightforward measurement process requires no special training. Reliability, precision and speed make the SUSS DSM8 the tool of choice for both R&D and production environments. It is frequently used in the manufacturing of MEMS devices, power semiconductors and optoelectronics.
When the DSM8 is employed together with a manual SUSS Mask Aligner you get the perfect package for your front-to-backside alignment application.
Product Highlights
- Measurement accuracy 0.5µm
- Intuitive and easy to use through step-by-step assistance
- Measurement results independent of operators skill
- Compact design - small footprint
- Optional available objectives: 5x, 10x, 20x
Upgrades
- Edge Handling Toolkit
