print «back

DSM8

For top-to-bottom side exposed or bonded wafers or substrates up to 8"

Features and Benefits

  • Inspection mode overlays both live images for first idea of alignment
  • Measurement results independent of operator's skill
  • Compact design - small footprint
  • Optional wafer carrier to prevent potential wafer damage
  • Cleanroom compatible

Double side alignment and exposure is frequently used in the manufacture of MEMS, power devices, integrated optics and PCBs. Front to Bottom Measurements Systems from SUSS are the ideal tool to verify the alignment of your double side alignment and exposure processes. The SUSS MicroTec DSM 8 is the ideal tool for verifying this alignment on 2 to 8" wafers.

The straightforward measurement process requires no special training. Reliability, precision and speed make the SUSS DSM8 the tool of choice for both R&D and production environments.