Mask Aligner

Unmatched Precision for Thin and Thick Film Applications

The SUSS MicroTec Mask Aligner has become synonymous with superior quality, high alignment accuracy, and sophisticated exposure optics. SUSS MicroTec offers a complete range of mask aligners for high-end fab automation, high volume production and R&D environments alike. SUSS MicroTec designs their mask aligner systems for lithography applications in the field of MEMS, Advanced Packaging, 3D Packaging, Compound Semiconductors, Power Devices, Photovoltaic, Nanotechnology and Wafer Level Optics.

SUSS MicroTec Mask Aligners process wafers from pieces up to 300mm in any kind of size, shape and thickness. The systems can be configured with manifold features that fit to various applications and are designed to achieve submicron resolution and overlay.

Lithopack 300

Automated Mask Aligners

Provide best possible cost of ownership by achieving highest throughput at superior alignment accuracy. Combine state of the art pattern recognition with excellent print results. Different product enhancements available to further optimize and advance the level of automation.

MA300 Gen2 (up to 300mm)
MA200Compact (up to 200mm)
MA150e (up to 150mm)
MA100e Gen2 (up to 100mm)

Lithopack 300

Manual Mask Aligners

Designed for scientific and industrial research but also for use in operator assisted production. Enable quick and effective development of new technologies and products. Support also emerging applications like UV-NIL, SCIL, NFH, bond alignment, stencil alignment, wafer level microlens UV replication and UV-bonding (SMILE).

MJB4 (up to 4")
MA/BA6 (up to 6")
MA/BA8 (up to 8")
MA/BA8 Gen3 (up to 8")

Related Products:

Lithopack 300

Integrated Lithography Cluster

SUSS Lithography Clusters are integrated coat, bake, expose, develop solutions that especially used in volume production of components for compound semiconductor, wafer-level packaging or MEMS applications.

LithoPack300 (up to 300mm)
LithoFab200 (up to 200mm)

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