MA/BA6 (Gen2)

The Lithography Benchmark from R&D to 3D MEMS Production

The SUSS MicroTec MA/BA6 Mask Aligner is regarded as the benchmark from semiconductor submicron research to 3D micro-system production. The innovative systems meets customer's needs for precision, reliability and low cost of ownership.

The MA6 is designed for all standard lithography applications. For thick resist MEMS applications the MA6 offers high quality exposure optics for high resolution and optimum edge quality. The Bottom Side Alignment option allows for pattern printing on both sides of the substrate. In addition the MA6 offers tailored features for fragile III-V compounds, thinned or warped wafers.

In addition the MA/BA6 Mask Aligner offers special techniques for bond alignment, Imprinting, and Near Field Holography.

Product Highlights

  • Accurate and precise gap setting for higher yield
  • Parameter storage saves set-up time and improves process consistency
  • High-quality exposure optics: Diffraction reducing lenses provide high resolution and optimum edge quality with thick resists
  • High intensity light sources reduce process time
  • Intelligent exposure control unit monitors lamp intensity and life time
  • Upgradable with retrofit kits for Nano Imprint Lithography (NIL)

Technologies

Upgrades

Photo Gallery

ma6-1

Information Materials

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